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evan.liu 3d6567819a CLI 新增 pinset 管脚高低电平命令 (Boot V1.00.07 / APP V1.00.31) 
- pinset <pxN> [0|1]: 设置 GPIO 输出高低 / 读当前电平 (pa0-6/pb0-13)
- Boot/src/boot_cli.c + mcm-ddc-ble/src/cli_core.c 各加一份同名命令
- 对 SWD(PA4/PA5) / 控制台(PB6/PB7) 重配前打印 warning
- Boot V1.00.06 -> V1.00.07; APP V1.00.30 -> V1.00.31 (0x0001001F)
- docs/开发日志.md: 新增 §59
2026-09-12 09:58:55 +08:00
..
__pycache__
修复Boot跳转后BLE失败:Boot跳转前__enable_irq( PRIMASK继承问题),APP/Boot的IRAM改从0x20004000起(低16KB为ROM/BLE保留区,踩了必HardFault);bootsetting增加start_address,Boot按地址跳转;merge_image.py生成缺省bootsetting并支持参数化;make_package改-r全量重建;mcm-ddc-ble重链接到0x01008000并出caiic_ble_full整包;HardFault加栈帧打印
2026-09-02 21:04:08 +08:00
NSpyocd
tools: commit the bundled production runtime (python-embed + NSpyocd + DFP pack)
2026-09-05 10:38:43 +08:00
out
CLI 新增 pinset 管脚高低电平命令 (Boot V1.00.07 / APP V1.00.31)
2026-09-12 09:58:55 +08:00
python-embed
tools: drop python-embed pyc caches from git (regenerated on first run)
2026-09-05 10:39:08 +08:00
ble_cli_test.py
mcm-ddc-ble V1.00.16~17:实测板载硅片为256KB(0x01040000起CPU读回绕/SWD fault),Flash布局回退256KB(Boot16K/bs8K/APP_DATA8K不变,APP1 0x01008000/112K,APP2 0x01024000/112K);新增appsw命令切换运行bank(记录校验+目标镜像CRC32复算防呆);uvprojx新增APP2 target(链接0x01024000,VTOR基址宏化,版本号可被target覆盖);新增make_dual_package.bat双APP整包脚本(merge_image.py支持--app2/--with-appdata);新增信息项0x07 CUR_BANK识别当前运行bank;OTA双bank配套:出包同时产bank1/bank2两份载荷(清单带target_bank),OTA_END校验镜像向量表Reset地址落在目标bank(新状态6 bank_mismatch);flash_package.bat改用DFP pack的n32wb031keq6_2 target+smart_flash=false;appsw双bank切换与CUR_BANK已实测通过;文档同步(开发日志37~39/ble_protocol.md/AGENTS.md)
2026-09-04 15:22:53 +08:00
ble_cli.bat
tools: self-contained portable production package
2026-09-05 10:34:59 +08:00
ble_ota_update.py
V1.00.26: UART baud 115200 -> 460800
2026-09-05 10:01:23 +08:00
ble_ota.bat
tools: self-contained portable production package
2026-09-05 10:34:59 +08:00
ble_temp_watch.py
mcm-ddc-ble V1.00.02~08：新增CLI读写特征(...c72e0003,写命令读应答)与只读参数特征(...c72e0004,全项TLV)；修复温度开机首读垃圾值(ADC初始化预热+丢弃首转)；blelog补写回调/CCCD订阅可见日志并修正CCCD值解析；tools新增bleak测试客户端(ble_cli_test.py/ble_cli.bat/ble_temp_watch.py)；make_package.bat改指mcm-ddc-ble；merge_image.py自动取APP_FW_VERSION_NUM写入OTA清单；AGENTS.md记录固件版本递增约定；开发日志第28节
2026-09-04 08:52:44 +08:00
flash_package.bat
tools: self-contained portable production package
2026-09-05 10:34:59 +08:00
flash_package.py
tools: self-contained portable production package
2026-09-05 10:34:59 +08:00
make_dual_package.bat
mcm-ddc-ble V1.00.16~17:实测板载硅片为256KB(0x01040000起CPU读回绕/SWD fault),Flash布局回退256KB(Boot16K/bs8K/APP_DATA8K不变,APP1 0x01008000/112K,APP2 0x01024000/112K);新增appsw命令切换运行bank(记录校验+目标镜像CRC32复算防呆);uvprojx新增APP2 target(链接0x01024000,VTOR基址宏化,版本号可被target覆盖);新增make_dual_package.bat双APP整包脚本(merge_image.py支持--app2/--with-appdata);新增信息项0x07 CUR_BANK识别当前运行bank;OTA双bank配套:出包同时产bank1/bank2两份载荷(清单带target_bank),OTA_END校验镜像向量表Reset地址落在目标bank(新状态6 bank_mismatch);flash_package.bat改用DFP pack的n32wb031keq6_2 target+smart_flash=false;appsw双bank切换与CUR_BANK已实测通过;文档同步(开发日志37~39/ble_protocol.md/AGENTS.md)
2026-09-04 15:22:53 +08:00
make_package.bat
tools: self-contained portable production package
2026-09-05 10:34:59 +08:00
make_release.bat
tools: self-contained portable production package
2026-09-05 10:34:59 +08:00
make_release.ps1
tools: self-contained portable production package
2026-09-05 10:34:59 +08:00
merge_image.py
boot V1.01.00: UART download mode (CLI + OTA frame upgrade in bootloader)
2026-09-05 17:25:53 +08:00
N32WB03x_DFP.1.4.0.pack
tools: commit the bundled production runtime (python-embed + NSpyocd + DFP pack)
2026-09-05 10:38:43 +08:00
requirements-ble.txt
tools: add requirements-ble.txt for the (git-ignored) .venv-ble
2026-09-05 10:07:14 +08:00
uart_cap.py
V1.00.26: UART baud 115200 -> 460800
2026-09-05 10:01:23 +08:00